Chinese smartphone firm, Xiaomi has almost done very well in year 2016. This year they are hitting hard on their upcoming flagship phone, the Xiaomi Mi 6. Leaks regarding this smartphone are been floating over internet for a long and now images are been leaked too.
Latest leak suggests that device will come with 2 variants, one with a flat panel display and the other one with a dual curved screen. Also the specs of both devices will be different. The flat panel variant of Xiaomi Mi6 will feature 4GB RAM, whereas the dual curved display variant will come with 6GB RAM and UFS 2.1 storage tech. But both devices will come with Qualcomm Snapdragon 835 chipset.
There has been no updates regarding the camera setup. Earlier leak rumors said that Mi 6 will sport a 5.15-inch display, but the resolution might be bumped to QHD and also a 4000mAh battery. Mi 6 is expected to come in three variants, Xiaomi Mi 6S, Mi 6E, and Mi 6P based on the type of processors they house. The Mi 6S stands for the Qualcomm Snapdragon SoC variant while the Mi 6E stands for a MediaTek SoC variant. There have been reports that the E would stand for Exynos chipset, while the P might come with Pinecone SoC.
Recently a Weibo user shared a benchmark report for a “prototype” Mi 6 where it’s said to have got a record score of 210,329, this score is higher than the record score of 183,106 of iPhone 7 Plus. If only Android phones, Snapdragon 821-powered OnePlus 3T has been the record holder so far, with a score of 163,578.
Though AnTuTu benchmark scores don’t necessarily guarantee a smartphone’s real world performance.